SK hynix Inc. has announced plans to build an advanced packaging, fabrication and R&D facility in West Lafayette, Indiana. The company, which specializes in high-bandwidth memory (HBM) chips, will invest $3.87 billion into the new plant, which will be used for artificial intelligence (AI) products. SK hynix hopes the project will drive innovation in the nation's AI supply chain.
In addition, the project is expected to generate more than a thousand new jobs. The new plant will feature an advanced semiconductor production line that will mass-produce HBM, the highest-performing dynamic random access memory (DRAM) chips. SK hynix also plans to use the facility to develop future generations of chips and house an advanced packaging R&D line. Operation at the West Lafayette plant is expected to begin in 2028.
What people are saying
In a recent quote, SK hynix CEO Kwak Noh-Jung said, "We are excited to become the first in the industry to build a state-of-the-art advanced packaging facility for AI products in the United States that will help strengthen supply-chain resilience and develop a local semiconductor ecosystem. With this new facility, we hope to advance our goal of providing AI memory chips with unmatched capabilities, serving the needs of our customers."
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