The U.S. Commerce Department has announced $3 billion in funding for the National Advanced Packaging Manufacturing Program. This money will be used to drive U.S. leadership in advanced packaging with an initial funding opportunity expected early next year. This includes advanced packaging piloting facilities and new workforce training programs.
In an effort to make their vision clear, CHIPS for America published “The Vision for the National Advanced Packaging Manufacturing Program” (NAPMP). The document outlines the mission and objectives for the advanced packaging program created by the bipartisan CHIPS and Science Act. According to the National Institute of Standards and Technology (NIST), NAPMP is one of four CHIPS for America R&D programs that are designed to help U.S. semiconductor fabrication plants produce better, more advanced technologies.
In a recent quote, Secretary of Commerce Gina Raimondo said, “Making substantial investments in domestic packaging capabilities and R&D is critical to creating a thriving semiconductor ecosystem in America. We need to make sure new leading-edge chip architectures can be invented in our research labs, designed for every end-use application, manufactured at scale and packaged with the most advanced technologies. This new vision for advanced packaging will enable us to implement President Biden’s Investing in America agenda and make our country a leader in leading-edge semiconductor manufacturing.”