TSMC and partners to establish advanced semiconductor manufacturing facility in Germany

Aug. 9, 2023
Total investment in the joint venture is expected to exceed 10 billion euros.

TSMC, in partnership with Robert Bosch GmbH, Infineon Technologies AG, and NXP Semiconductors N.V., will invest in European Semiconductor Manufacturing Company (ESMC) GmbH to produce advanced semiconductor manufacturing in Dresden, Germany. TSMC will own 70% of the joint venture, with the remaining companies owning 10% each. The facility will have a monthly production capacity of 40,000 300mm (12-inch) wafers on TSMC’s 28/22 nanometer planar CMOS and 16/12 nanometer FinFET process technology. The project will generate nearly 2,000 new jobs, with construction beginning in 2024 and production starting in 2027. Total investment in the joint venture is expected to exceed 10 billion euros.

In a recent quote, Dr. CC Wei, Chief Executive Officer of TSMC, said, “This investment in Dresden demonstrates TSMC’s commitment to serving our customers’ strategic capacity and technology needs, and we are excited at this opportunity to deepen our long-standing partnership with Bosch, Infineon, and NXP. Europe is a highly promising place for semiconductor innovation, particularly in the automotive and industrial fields, and we look forward to bringing those innovations to life on our advanced silicon technology with the talent in Europe.”

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