Balluff's distributed modular I/O is designed for industrial Ethernet expandable architecture
Balluff introduces distributed modular I/O for industrial Ethernet expandable architecture for EtherNet/IP and PROFINET controls applications. Balluff’s distributed modular I/O is designed to replace standard slice I/O and distributed I/O solutions. Offering IP67 protection and industry-standard connectors, the distributed modular I/O is engineered to collect several types of control data. Using standard 3-conductor cables, up to four slave devices can be connected to each master block, which is built to communicate over the industrial Ethernet network to the controller.
In lieu of a backplane, each I/O device is connected to an M12 port, creating an IP67 connection. With the ability to be installed within a 20-meter radius from the master device, slave devices can be distributed across the machine.