Balluff's distributed modular I/O is designed for industrial Ethernet expandable architecture

Balluff introduces distributed modular I/O for industrial Ethernet expandable architecture for EtherNet/IP and PROFINET controls applications. Balluff’s distributed modular I/O is designed to replace standard slice I/O and distributed I/O solutions. Offering IP67 protection and industry-standard connectors, the distributed modular I/O is engineered to collect several types of control data. Using standard 3-conductor cables, up to four slave devices can be connected to each master block, which is built to communicate over the industrial Ethernet network to the controller.

In lieu of a backplane, each I/O device is connected to an M12 port, creating an IP67 connection. With the ability to be installed within a 20-meter radius from the master device, slave devices can be distributed across the machine.

Product Type:
Show Comments
Hide Comments

Join the discussion

We welcome your thoughtful comments.
All comments will display your user name.

Want to participate in the discussion?

Register for free

Log in for complete access.


No one has commented on this page yet.

RSS feed for comments on this page | RSS feed for all comments