Master Bond's Polymer System EP37-3FLF optically clear, two-component epoxy resists severe thermal cycling
Master Bond's Polymer System EP37-3FLF optically clear, two-component epoxy resists cryogenic temperatures and severe thermal cycling. It is designed to cure without stressing electronic components.
Serviceable over the range of 4 K to 250° F, EP37-3FLF cures at room temperature in two to three days or faster at elevated temperatures. The epoxy offers a 1 to 1 mix ratio by weight or volume, and a mixed viscosity of 1,400 to 1,500 cps. Users can work with a 100-gram mass of the adhesive at room temperature for up to 90 minutes.
EP37-3FLF has a bond shear strength exceeding 2,000 psi and a T-peel strength of 25 pli. The flexible epoxy has an elongation of 180% and electrical insulation properties with a volume resistivity of 1x1014 ohm-cm.