Master Bond's EP21ANHT thermally conductive epoxy system is designed for miniaturized electronic circuits
Master Bond has developed a thermally conductive epoxy system that is designed to help mitigate the issues associated with tightly packed components and miniaturized electronic circuits. With a thermal conductivity over 22 BTU/in/ft²/hr/º F and serviceability from -60 to 400° F, Master Bond EP21ANHT can be used as an electrical insulator. This two-component adhesive, sealant and coating has a 1-to-1 mix ratio by weight or volume, and offers room temperature and faster elevated temperature cures. EP21ANHT has a coefficient of thermal expansion of 18-20 in/in x 10-6/º C, a dielectric strength of >400 volts/mil and a tensile shear strength greater than 1,000 psi.