Master Bond's EP21TDCHT-LO two-part epoxy adhesive/sealant is formulated for demanding applications
Master Bond's EP21TDCHT-LO two-part epoxy adhesive/sealant is formulated for demanding applications where factors like temperature cycling, high vibration and mechanical shock are an issue. It is engineered to withstand cryogenic temperatures and meets NASA low outgassing specifications. EP21TDCHT-LO has a mix ratio of 1:1 by weight or volume, and is formulated to cure at room temperature or more rapidly at elevated temperatures.
EP21TDCHT-LO is designed for bonding dissimilar substrates, especially when they have differing coefficients of expansion. It has a service temperature range from 4K to +350º F. It also features a shear strength exceeding 2500 psi, a peel strength of greater than 20 pli and a Shore D hardness of greater than 60.