Master Bond's EP21FL two-part epoxy resin system dissimilar substrates with different coefficients of expansion
Master Bond EP21FL is a two-part epoxy resin system that features low to moderate viscosity. It is well suited for potting, coating and sealing electronic assemblies, and bonds dissimilar substrates with different coefficients of expansion.
This high-performance adhesive has a service temperature range of -60ºF to +250ºF. The typical viscosity of Part A is 4,000 cps at 25ºC and 10,000 cps at 25ºC for Part B. This system produces high-strength castings, bonds and seals that are resistant to thermal cycling and shock. Its bond strength is generally greater than 1,500 psi, and its tensile strength normally exceeds 1,100 psi. The hardened compound is an electrical insulator with a volume resistivity greater than 1012 ohm-cm. As a flexibilized system, it is characterized by impact and chemical resistance. EP21FL is available in half pint, pint, quart, one-gallon and five-gallon container kits.